Title :
A novel compact microstrip-to-waveguide transition structure for integration with multilayered circuits
Author :
Yu Liu ; Ping Cao ; Cheng Hong ; Meng Cai
Author_Institution :
Huawei Technol. Co., Ltd., Shenzhen, China
Abstract :
A novel compact microstrip-to-waveguide transition is presented. In this structure, the backshort is surrounded by metal vias and integrated with a multilayered circuit board. The bottom of the backshort is formed by an array of metal blind vias with periodic structure. An air blind via array is drilled into the substrate within the backshort. Therefore the cross-section dimensions of the backshort are recalculated. A model is designed and simulated at 60 GHz using HFSS, and the simulation results validate the effectiveness of this compact microstrip-to-waveguide transition structure.
Keywords :
electrical engineering computing; microstrip circuits; millimetre wave circuits; substrate integrated waveguides; waveguide transitions; HFSS; compact microstrip-to-waveguide transition structure; cross-section dimensions; frequency 60 GHz; metal blind vias array; multilayered circuit board; periodic structure; Arrays; Bandwidth; Computational modeling; Dielectric constant; Metals; Microstrip; Substrates;
Conference_Titel :
Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2014 39th International Conference on
Conference_Location :
Tucson, AZ
DOI :
10.1109/IRMMW-THz.2014.6956376
