DocumentCode
1533250
Title
30-nm InAs PHEMTs With
and
Author
Kim, Dae-Hyun ; Del Alamo, Jesus A.
Author_Institution
Microsyst. Technol. Lab., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume
31
Issue
8
fYear
2010
Firstpage
806
Lastpage
808
Abstract
We present 30-nm InAs pseudomorphic HEMTs (PHEMTs) on an InP substrate with record fT characteristics and well-balanced fT and fmax values. This result was obtained by improving short-channel effects through widening of the side-recess spacing (Lside) to 150 nm, as well as reducing parasitic source and drain resistances. To compensate for an increase in Rs and Rd due to Lside widening, we optimized the ohmic contact process so as to decrease the specific ohmic contact resistance (Rc) to the InGaAs cap to 0.01 Ω·mm. A 30-nm InAs PHEMT with tins = 4 nm exhibits excellent gm,max of 1.9 S/mm, fT of 644 GHz, and fmax of 681 GHz at VDS = 0.5 V simultaneously. To the knowledge of the authors, the obtained fT in this work is the highest ever reported in any FET on any material system. This is also the first demonstration of simultaneous fT and fmax higher than 640 GHz in any transistor technology.
Keywords
III-V semiconductors; high electron mobility transistors; indium compounds; microwave field effect transistors; ohmic contacts; InAs; drain resistances; frequency 644 GHz; frequency 681 GHz; ohmic contact process; parasitic source; pseudomorphic HEMT; short channel effect; side recess spacing; size 30 nm; Cutoff frequency $(f_{T})$ ; InAs; maximum oscillation frequency $(f_{max})$ ; pseudomorphic HEMTs (PHEMTs); short-channel effects; side-recess spacing $(L_{rm side})$ ;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2010.2051133
Filename
5508349
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