• DocumentCode
    1533739
  • Title

    A model for optimizing the assembly and disassembly of electronic systems

  • Author

    Sandborn, Peter A. ; Murphy, Cynthia F.

  • Author_Institution
    CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
  • Volume
    22
  • Issue
    2
  • fYear
    1999
  • fDate
    4/1/1999 12:00:00 AM
  • Firstpage
    105
  • Lastpage
    117
  • Abstract
    This paper presents a methodology that incorporates simultaneous consideration of economic and environmental merit during the virtual prototyping phase of electronic product design. A model that allows optimization of a product life cycle, which includes primary assembly, disassembly, and secondary assembly using a mix of new and salvaged components, is described. Optimizing this particular life cycle scenario is important for products that are leased to customers or subject to product take-back laws. Monte Carlo simulation is used to account for uncertainty in the data, and demonstrates that high-level design and process decisions may be made with a few basic metrics and without highly specific data sets for every material and component used in a product. A web-based software tool has been developed that implements this methodology
  • Keywords
    Monte Carlo methods; design for environment; product development; rapid prototyping (industrial); recycling; Monte Carlo simulation; disassembly; economic merit; electronic product design; electronic systems; environmental merit; high-level design; life cycle scenario; primary assembly; process decisions; product life cycle; secondary assembly; virtual prototyping phase; web-based software tool; Assembly systems; Costs; Design optimization; Electronic equipment testing; Joining processes; Manufacturing; Materials testing; Product design; Virtual prototyping; Waste materials;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/6104.778170
  • Filename
    778170