• DocumentCode
    1533745
  • Title

    Integrating environmental objectives in the operational planning of printed circuit board assembly

  • Author

    Worhach, Paul ; Sheng, Paul

  • Author_Institution
    Bechtel Corp., San Francisco, CA, USA
  • Volume
    22
  • Issue
    2
  • fYear
    1999
  • fDate
    4/1/1999 12:00:00 AM
  • Firstpage
    118
  • Lastpage
    127
  • Abstract
    This paper presents a methodology for operational control of printed circuit board (PCB) assembly systems with respect to environmental objectives for managing per-unit and per-setup waste flows. The approach builds upon the concept of unit process modeling, process chaining and evaluation of multicriteria effects first applied to product design. Three approaches are used to guide planning and control decisions for the management of hazard profiles at the facility level: product assignment, worker assignment, and a hybrid approach. The optimization models seek to balance overall waste mass and facility-level hazard given throughput constraints and demand requirements. A case example is given for scheduling six board types over four production lines in a two-shift operation
  • Keywords
    assembly planning; environmental factors; printed circuit manufacture; demand requirements; environmental objectives; facility-level hazard; hazard profiles; multicriteria effects; operational planning; optimization models; per-setup waste flows; per-unit waste flows; printed circuit board assembly; process chaining; product assignment; throughput constraints; two-shift operation; unit process modeling; worker assignment; Assembly systems; Constraint optimization; Control systems; Environmental management; Hazards; Printed circuits; Product design; Production; Throughput; Waste management;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/6104.778171
  • Filename
    778171