DocumentCode
1533745
Title
Integrating environmental objectives in the operational planning of printed circuit board assembly
Author
Worhach, Paul ; Sheng, Paul
Author_Institution
Bechtel Corp., San Francisco, CA, USA
Volume
22
Issue
2
fYear
1999
fDate
4/1/1999 12:00:00 AM
Firstpage
118
Lastpage
127
Abstract
This paper presents a methodology for operational control of printed circuit board (PCB) assembly systems with respect to environmental objectives for managing per-unit and per-setup waste flows. The approach builds upon the concept of unit process modeling, process chaining and evaluation of multicriteria effects first applied to product design. Three approaches are used to guide planning and control decisions for the management of hazard profiles at the facility level: product assignment, worker assignment, and a hybrid approach. The optimization models seek to balance overall waste mass and facility-level hazard given throughput constraints and demand requirements. A case example is given for scheduling six board types over four production lines in a two-shift operation
Keywords
assembly planning; environmental factors; printed circuit manufacture; demand requirements; environmental objectives; facility-level hazard; hazard profiles; multicriteria effects; operational planning; optimization models; per-setup waste flows; per-unit waste flows; printed circuit board assembly; process chaining; product assignment; throughput constraints; two-shift operation; unit process modeling; worker assignment; Assembly systems; Constraint optimization; Control systems; Environmental management; Hazards; Printed circuits; Product design; Production; Throughput; Waste management;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/6104.778171
Filename
778171
Link To Document