Title :
Three-dimensional inspection of ball grid array using laser vision system
Author :
Kim, Pyunghyun ; Rhee, Sehun
Author_Institution :
Dept. of Mech. Eng., Hanyang Univ., Seoul, South Korea
fDate :
4/1/1999 12:00:00 AM
Abstract :
An inspection process of the ball grid array (BGA) is proposed using a laser vision system which provides range image. This study suggests an inspection algorithm using the range images for evaluating the height of the solder ball, coplanarity and lead pitch, which are major factors in the BGA surface mounting technology. A feature-based algorithm was used in implementing region segmentation of range images. By deciding the BGA orientation using plane modeling, the errors of the range finding system were compensated and the reference of the height of the solder ball was found. Also, a method for measuring the height of the solder ball using free-form surface modeling was proposed. And, from the measured heights, the pitches and coplanarity were calculated
Keywords :
ball grid arrays; computer vision; image segmentation; inspection; measurement by laser beam; surface mount technology; ball grid array; coplanarity; feature-based algorithm; laser vision system; lead pitch; plane model; range image region segmentation; solder ball height; surface model; surface mounting technology; three-dimensional inspection; Electronics packaging; Image processing; Image sensors; Inspection; Integrated circuit measurements; Laser modes; Lead; Machine vision; Semiconductor device measurement; X-ray imaging;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/6104.778175
