• DocumentCode
    1533946
  • Title

    Application of covariance structures to improve the fit of response surfaces to simulation data

  • Author

    Waring, Thomas G. ; Walton, Anthony J. ; Ferguson, Stuart ; Sprevak, Dan

  • Author_Institution
    Dept. of Electr. Eng., Edinburgh Univ., UK
  • Volume
    12
  • Issue
    3
  • fYear
    1999
  • fDate
    8/1/1999 12:00:00 AM
  • Firstpage
    366
  • Lastpage
    374
  • Abstract
    This paper presents a covariance-based interpolating procedure for constructing response surfaces that pass through all the data points created by computer-based experiments. The justification for this approach is that simulation-based experiments, in general, do not suffer from random errors. The paper presents the method in the context of fitting response surfaces to TCAD results for VLSI processes. It is shown that there can be a real benefit from using these covariance-based models when polynomial-based response surfaces have difficulty accurately representing the simulated variation. A number of examples are presented, one of which is a plateau region next to a steep cliff, which is well known to present a severe challenge to the fitting of response surfaces
  • Keywords
    VLSI; circuit simulation; covariance analysis; digital simulation; interpolation; semiconductor process modelling; surface fitting; technology CAD (electronics); TCAD results; VLSI processes; covariance structures; data points; interpolating procedure; plateau region; response surfaces; simulation data; simulation-based experiments; Computational modeling; Computer errors; Computer simulation; Design for experiments; Polynomials; Predictive models; Response surface methodology; Semiconductor process modeling; Surface fitting; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.778205
  • Filename
    778205