DocumentCode
1533946
Title
Application of covariance structures to improve the fit of response surfaces to simulation data
Author
Waring, Thomas G. ; Walton, Anthony J. ; Ferguson, Stuart ; Sprevak, Dan
Author_Institution
Dept. of Electr. Eng., Edinburgh Univ., UK
Volume
12
Issue
3
fYear
1999
fDate
8/1/1999 12:00:00 AM
Firstpage
366
Lastpage
374
Abstract
This paper presents a covariance-based interpolating procedure for constructing response surfaces that pass through all the data points created by computer-based experiments. The justification for this approach is that simulation-based experiments, in general, do not suffer from random errors. The paper presents the method in the context of fitting response surfaces to TCAD results for VLSI processes. It is shown that there can be a real benefit from using these covariance-based models when polynomial-based response surfaces have difficulty accurately representing the simulated variation. A number of examples are presented, one of which is a plateau region next to a steep cliff, which is well known to present a severe challenge to the fitting of response surfaces
Keywords
VLSI; circuit simulation; covariance analysis; digital simulation; interpolation; semiconductor process modelling; surface fitting; technology CAD (electronics); TCAD results; VLSI processes; covariance structures; data points; interpolating procedure; plateau region; response surfaces; simulation data; simulation-based experiments; Computational modeling; Computer errors; Computer simulation; Design for experiments; Polynomials; Predictive models; Response surface methodology; Semiconductor process modeling; Surface fitting; Very large scale integration;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.778205
Filename
778205
Link To Document