DocumentCode
1533954
Title
An iterative cutting procedure for determining the optimal wafer exposure pattern
Author
Chen-Fu Chien ; Shao-Chung Hsu ; Chih-Ping Chen
Author_Institution
Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing Hua Univ., Hsinchu
Volume
12
Issue
3
fYear
1999
fDate
8/1/1999 12:00:00 AM
Firstpage
375
Lastpage
377
Abstract
Conventionally, people focus on defect reduction to improve yield rate. Little research has been done to deal with the problem of optimizing wafer exposure patterns. This paper develops a computer-based procedure to maximize the number of dies possibly produced from a wafer. A program has been developed and implemented in a 6-in wafer fabrication factory in Taiwan. The results validate the practical viability of the proposed procedure
Keywords
cutting; integrated circuit yield; iterative methods; optimisation; dies; iterative cutting procedure; optimal wafer exposure pattern; wafer fabrication factory; yield rate; Costs; Councils; Expert systems; Fabrication; Investments; Optimization methods; Production facilities; Sawing; Shape; Upper bound;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.778206
Filename
778206
Link To Document