A three-layer 3D silicon system using through-Si vertical optical interconnections and Si CMOS hybrid building blocks

Author

Bond, Steven W. ; Vendier, Olivier ; Lee, Myunghee ; Jung, Sungyong ; Vrazel, Michael ; Lopez-Lagunas, Abelardo ; Chai, Sek ; Dagnall, Georgianna ; Brooke, Martin ; Jokerst, Nan Marie ; Wills, D. Scott ; Brown, April

Author_Institution

Lawrence Livermore Nat. Lab., CA, USA

Volume

5

Issue

2

fYear

1999

Firstpage

276

Lastpage

286

Abstract

We present for the first time a three-dimensional (3D) Si CMOS interconnection system consisting of three layers of optically interconnected hybrid integrated Si CMOS transceivers. The transceivers were fabricated using 0.8-μm digital Si CMOS foundry circuits and were integrated with long wavelength InP-based emitters and detectors for through-Si vertical optical interconnections. The optical transmitter operated with a digital input and optical output with operation speeds up to 155 Mb/s. The optical receiver operated with an external optical input and a digital output up to 155 Mb/s. The transceivers were stacked to form 3D through-Si vertical optical interconnections and a fabricated three layer stack demonstrated optical interconnections between the three layers with operational speed of 1 Mb/s and bit-error rate of 10^-9

Keywords

CMOS integrated circuits; integrated circuit technology; integrated optoelectronics; optical fabrication; optical interconnections; optical receivers; optical transmitters; photodetectors; semiconductor lasers; silicon; surface emitting lasers; transceivers; 0.8 mum; 0.8-μm digital Si CMOS foundry circuits; 1 Mbit/s; 155 Mbit/s; 3D through-Si vertical optical interconnections; InP; Si; Si CMOS hybrid building blocks; bit-error rate; digital input; external optical input; long wavelength InP-based emitters; operation speeds; operational speed; optical interconnections; optical output; optical transmitter; optically interconnected hybrid integrated Si CMOS transceivers; photodetectors; three layer stack; three-layer 3D silicon system; through-Si vertical optical interconnections; CMOS digital integrated circuits; Foundries; Integrated circuit interconnections; Integrated optics; Optical interconnections; Optical receivers; Optical transmitters; Silicon; Stimulated emission; Transceivers;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/2944.778306

Filename

778306