DocumentCode
1535181
Title
An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis
Author
Zhang, Yao-Jiang ; Fan, Jun
Author_Institution
Dept. of Electr. & Comput. Eng., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Volume
58
Issue
8
fYear
2010
Firstpage
2251
Lastpage
2265
Abstract
An irregular plate pair with multiple vias is analyzed by the segmentation method that divides the plate pair into a plate domain and via domains. In the via domains, all the parallel-plate modes are considered, while in the plate domain, only the propagating modes are included to account for the coupling among vias and the reflection from plate edges. Boundary conditions at both vias and plate edges are enforced and all parasitic components of via circuit are expressed analytically in terms of parallel-plate modes. The work presented in this paper indicates that a previous physics-based via circuit model from intuition is a low-frequency approximation. Analytical and numerical simulations, as well as measurements, have been used to validate the intrinsic via circuit model.
Keywords
electromagnetic wave propagation; integrated circuit modelling; boundary conditions; electromagnetic analysis; intrinsic circuit model; irregular plate pair; numerical simulations; parallel-plate modes; physics-based circuit model; segmentation method; via domains; Boundary conditions; Circuits; Crosstalk; Electromagnetic analysis; Electromagnetic modeling; Electromagnetic scattering; Nonhomogeneous media; Packaging; Power systems; Reflection; Intrinsic via circuit model; parallel-plate modes; physics-based via circuit model; segmentation technique; signal and power integrity;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2010.2052956
Filename
5510005
Link To Document