• DocumentCode
    1535181
  • Title

    An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis

  • Author

    Zhang, Yao-Jiang ; Fan, Jun

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
  • Volume
    58
  • Issue
    8
  • fYear
    2010
  • Firstpage
    2251
  • Lastpage
    2265
  • Abstract
    An irregular plate pair with multiple vias is analyzed by the segmentation method that divides the plate pair into a plate domain and via domains. In the via domains, all the parallel-plate modes are considered, while in the plate domain, only the propagating modes are included to account for the coupling among vias and the reflection from plate edges. Boundary conditions at both vias and plate edges are enforced and all parasitic components of via circuit are expressed analytically in terms of parallel-plate modes. The work presented in this paper indicates that a previous physics-based via circuit model from intuition is a low-frequency approximation. Analytical and numerical simulations, as well as measurements, have been used to validate the intrinsic via circuit model.
  • Keywords
    electromagnetic wave propagation; integrated circuit modelling; boundary conditions; electromagnetic analysis; intrinsic circuit model; irregular plate pair; numerical simulations; parallel-plate modes; physics-based circuit model; segmentation method; via domains; Boundary conditions; Circuits; Crosstalk; Electromagnetic analysis; Electromagnetic modeling; Electromagnetic scattering; Nonhomogeneous media; Packaging; Power systems; Reflection; Intrinsic via circuit model; parallel-plate modes; physics-based via circuit model; segmentation technique; signal and power integrity;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2010.2052956
  • Filename
    5510005