• DocumentCode
    1535492
  • Title

    An Investigation of Electrothermal Characteristics on Low-Temperature Polycrystalline-Silicon Thin-Film Transistors

  • Author

    Tai, Ya-Li ; Lee, Jam-Wem ; Lien, Chen-Hsin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    10
  • Issue
    1
  • fYear
    2010
  • fDate
    3/1/2010 12:00:00 AM
  • Firstpage
    96
  • Lastpage
    99
  • Abstract
    In this paper, theoretical and experimental analyses have been performed to explore the electrothermal characteristics in low-temperature polycrystalline-silicon thin-film transistors (LTPS TFTs). A theoretical simulation reveals that electrothermal effects strongly influence the performance of LTPS TFTs, particularly under high-current conditions. Measurements show that, under extremely high currents, LTPS devices demonstrate an open-circuit behavior, while the behavior of devices based on single-crystalline silicon films using an SOI CMOS process results in a short-circuit model. In summary, both the simulation and measurements indicate that grain boundaries will degrade the electrothermal properties of the LTPS thin film and suppress reliability in TFT design.
  • Keywords
    MOSFET; elemental semiconductors; grain boundaries; semiconductor device models; semiconductor thin films; silicon; silicon-on-insulator; thermoelectricity; thin film transistors; SOI CMOS process; Si-SiO2; TFT design; electrothermal properties; grain boundary degradation; high current conditions; low-temperature polycrystalline-silicon thin-film transistors; open-circuit behavior; short-circuit model; silicon-on-insulator complementary metal-oxide semiconductor; Electrostatic discharge (ESD); electrothermal effects; grain boundaries; low-temperature polycrystalline-silicon thin-film transistor (LTPS TFT);
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2009.2035105
  • Filename
    5308290