Abstract :
Started in 2001, this IEEE transaction (T-DMR) focuses on component reliability and documents the search for the root cause of failure in increasingly more complex devices and in the materials used to make these devices. The physics of failure, a watchword in the semiconductor industry, reveals new phenomenon that show up as weakness in design, process, material, or application. The determination and elimination of the root cause of failure invariably involves a multidisciplined effort. Electrical engineering, physics, materials, chemistry, processing, and packaging mix to generate a cost-effective solution.
