Title :
Development of a millimeter-wave system-on-a-package utilizing MCM integration
Author :
Pham, A. ; Ramachandran, R. ; Laskar, J. ; Krishnamurthy, V. ; Bates, D. ; Marcinkewicz, W. ; Schmanski, B. ; Piacente, P. ; Sprinceanu, L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
fDate :
10/1/2001 12:00:00 AM
Abstract :
We present the development of a system-on-a-package at millimeter-wave frequencies utilizing a commercially available multichip-module process. This technology has established a platform for integrating multiple components of different material systems to combine digital application-specific integrated circuits (ASICs), radio-frequency integrated circuits, and microelectromechanical devices onto a package. The multilayer polymer thin films also empower the design and fabrication of integral passive devices, including thin-film resistors, filters, and Wilkinson power combiners
Keywords :
integrated circuit packaging; millimetre wave integrated circuits; multichip modules; MCM integration; Wilkinson power combiner; digital ASIC; filter; integral passive device; microelectromechanical device; millimeter-wave system-on-a-package; multilayer polymer thin film; radiofrequency integrated circuit; thin film resistor; Application specific integrated circuits; Frequency; Integrated circuit packaging; Integrated circuit technology; Microelectromechanical devices; Millimeter wave integrated circuits; Millimeter wave technology; Nonhomogeneous media; Polymer films; Radiofrequency integrated circuits;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
