• DocumentCode
    1538645
  • Title

    N2 gas absorption in cathodic arc apparatus with an Al cathode under medium vacuum

  • Author

    Takikawa, Hirofumi ; Kawakami, Naoya ; Sakakibara, Tateki

  • Author_Institution
    Toyohashi Univ. of Technol., Japan
  • Volume
    27
  • Issue
    4
  • fYear
    1999
  • fDate
    8/1/1999 12:00:00 AM
  • Firstpage
    1034
  • Lastpage
    1038
  • Abstract
    Al evaporation and N2 absorption rates during cathodic arc evaporation with an Al cathode and N2 gas flow were measured as a function of process pressure under medium pressure. These rates decreased as the pressure increased. The ratio of the Al evaporation rate to the N2 absorption rate was about 2:1. The film deposited on the anode chamber was analyzed by an X-ray diffraction analyzer and found to be aluminum nitride (AlN). This result indicates that N2 gas is mostly absorbed and fixed in the deposits on the anode surface in the form of AlN
  • Keywords
    absorption; cathodes; evaporation; nitrogen; plasma CVD; vacuum arcs; -1 to 10 min; 0.1 to 10 Pa; Al; Al cathode; Al evaporation rate; AlN; AlN film; N2; N2 absorption rate; N2 absorption rates; N2 gas; N2 gas absorption; N2 gas flow; X-ray diffraction analysis; anode chamber; anode surface; cathodic arc evaporation; cathodic vacuum arc apparatus; deposits; film deposition; medium pressure; medium vacuum; pressure dependence; process pressure; scanning electron micrography; Anodes; Cathodes; Electromagnetic wave absorption; Fluid flow; Magnetic films; Optical films; Piezoelectric films; Scanning electron microscopy; Semiconductor films; Vacuum arcs;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.782277
  • Filename
    782277