DocumentCode
1538922
Title
A fault-tolerant array processor designed for testability and self-reconfiguration
Author
Jain, Ajai ; Mandava, Babu ; Rajski, Janusz ; Rumin, Nicholas C.
Author_Institution
Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
Volume
26
Issue
5
fYear
1991
fDate
5/1/1991 12:00:00 AM
Firstpage
778
Lastpage
788
Abstract
The design of a fault-tolerant rectangular array of processing elements (PEs) is presented in which the reconfiguration is done by means of on-chip distributed logic, without the help of any external host. Spare PEs are included in every column of the array, and faulty PEs are bypassed within a column to facilitate reconfiguration in the presence of faults. Scan paths are used to enhance the testability of the array. PEs are tested locally using near-neighbor comparisons without the need of an external host. Because the interconnections between logical neighbors are short, the speed penalty for reconfiguration is very small. Any amount of redundancy can be incorporated in the array without changing the topology of the scheme or the design of the reconfiguration switches. The scheme is well suited for very large-area, high-density chips and wafer-scale integration. In order to demonstrate the capabilities of the scheme and evaluate its performance, an experimental chip consisting of a 6×4 array was designed, fabricated, and tested. Details of the design and the implementation of the chip are presented. The scheme is also analyzed for yield and area utilization for a range of array sizes and PE survival probabilities
Keywords
CMOS integrated circuits; cellular arrays; fault tolerant computing; integrated circuit testing; logic testing; microprocessor chips; parallel architectures; redundancy; array processor; fault-tolerant rectangular array; high-density chips; multiprocessors; on-chip distributed logic; redundancy; scan paths; self-reconfiguration; testability; wafer-scale integration; Fault tolerance; Logic arrays; Logic design; Process design; Reconfigurable logic; Redundancy; Switches; Testing; Topology; Wafer scale integration;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/4.78249
Filename
78249
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