Title :
Thin-film circuit technology: Part I — Thin-film R-C networks
Author :
Lessor, A.E. ; Maissel, L.I. ; Thun, R.E.
Author_Institution :
International Business Machines Corporation
fDate :
4/1/1964 12:00:00 AM
Abstract :
Miniaturization requirements have brought about the integral fabrication of many components. The thin-film approach permits the integration of numerous precision circuit elements and their interconnections. Part I of this three-part series deals mainly with the two deposition techniques of cathode sputtering and vacuum evaporation, and with their use in the fabrication of film resistors, capacitors, and R-C networks. Subsequent articles will discuss thin-film transistors and cryogenic thin films Part I — Thin-film R-C networks
Journal_Title :
Spectrum, IEEE
DOI :
10.1109/MSPEC.1964.6500525