Finite elements and absorbing boundary conditions for scattering problems on a parallel distributed memory computer

Author

Vollaire, C. ; Nicolas, L. ; Nicolas, A.

Author_Institution

CEGELY-UPRESA CNRS, Ecole Centrale de Lyon, Ecully, France

Volume

33

Issue

2

fYear

1997

fDate

3/1/1997 12:00:00 AM

Firstpage

1448

Lastpage

1451

Abstract

An efficient finite element method is presented to compute time harmonic microwave field in three dimensional configurations. Nodal-based finite elements have been coupled with an algorithm boundary condition to solve open boundary problems. Modeling real devices is made possible using parallel computation. This paper describes first the time harmonic formulation with the absorbing boundary condition and the sequential code. A new algorithm is then proposed to implement this formulation on a cluster of workstations (10 DEC ALPHA 300X). Analysis of efficiency is performed using simple problems. The electromagnetic scattering of a plane wave by a perfect electric conductor cylinder is finally given as example

Keywords

distributed memory systems; electrical engineering; electrical engineering computing; electromagnetic wave scattering; finite element analysis; parallel algorithms; parallel machines; DEC ALPHA 300X; absorbing boundary conditions; algorithm boundary condition; cluster of workstations; device modelling; efficiency analysis; electromagnetic plane wave scattering; finite element method; nodal based finite elements; open boundary problems; parallel algorithm; parallel computation; parallel distributed memory computer; perfect electric conductor cylinder; scattering problems; sequential code; three dimensional configurations; time harmonic formulation; time harmonic microwave field; Boundary conditions; Clustering algorithms; Concurrent computing; Conductors; Electromagnetic scattering; Finite element methods; Microwave devices; Microwave theory and techniques; Performance analysis; Workstations;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/20.582532

Filename

582532