DocumentCode :
1541183
Title :
Optimizing the performance of a surface mount placement machine
Author :
Ellis, Kimberly P. ; Vittes, Fernando J. ; Kobza, John E.
Author_Institution :
Grado Dept. of Ind. & Syst. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume :
24
Issue :
3
fYear :
2001
fDate :
7/1/2001 12:00:00 AM
Firstpage :
160
Lastpage :
170
Abstract :
Process planning is an important and integral part of effectively operating a printed circuit board (PCB) assembly system. A PCB assembly system generally consists of different types of placement machines, testing equipment, and material handling equipment. This research develops a new solution approach to determine the component placement sequence and feeder arrangement for a turret style surface mount-placement machine often used in PCB assembly systems. This solution approach can be integrated into a process planning system to reduce assembly time and improve productivity. The algorithm consists of a construction procedure that uses a set of rules to generate an initial component placement sequence and feeder arrangement along with an improvement procedure to improve the initial solution. An industrial case study conducted at Ericsson, Inc., using a Fuji CP4-3 machine and actual PCB data, is presented to demonstrate the performance of the proposed solution approach. The solutions obtained using the proposed solution approach are compared to those obtained using state of the art PCB assembly process optimization software. For all PCBs in the case study, the proposed solution approach yielded lower placement times than the commercial software, thus generating additional valuable production capacity. This research is applicable for both researchers and practitioners in printed circuit board assembly systems
Keywords :
assembly planning; optimisation; printed circuit manufacture; surface mount technology; Ericsson; Fuji CP4-3 machine; PCB assembly system; assembly time; component placement sequence; construction procedure; feeder arrangement; initial component placement sequence; placement times; process planning; production capacity; productivity; turret style surface mount-placement machine; Assembly systems; Circuit testing; Construction industry; Machinery production industries; Materials handling equipment; Materials testing; Printed circuits; Process planning; Productivity; System testing;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/6104.956801
Filename :
956801
Link To Document :
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