DocumentCode :
1541409
Title :
Chips in 3D
Author :
Markov, Igor
Author_Institution :
University of Michigan
Volume :
27
Issue :
4
fYear :
2010
Firstpage :
68
Lastpage :
69
Abstract :
This is a review of Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures (by Yuan Xie, Jason Cong, and Sachin Sapatnekar, eds.).
Keywords :
Avatars; Circuit testing; Electronic design automation and methodology; Heat transfer; Integrated circuit technology; Microarchitecture; Network-on-a-chip; Stacking; Thermal conductivity; Three-dimensional integrated circuits; 3D integration; EDA; VLSI; circuit design; computer architecture; design and test;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/MDT.2010.81
Filename :
5512526
Link To Document :
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