DocumentCode :
154164
Title :
Thanks
fYear :
2014
fDate :
20-23 May 2014
Firstpage :
1
Lastpage :
4
Abstract :
The conference organizers greatly appreciate the support of the various corporate sponsors listed.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Hose, CA, USA
Print_ISBN :
978-1-4799-5016-4
Type :
conf
DOI :
10.1109/IITC.2014.6831829
Filename :
6831829
Link To Document :
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