Title :
Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects
Author :
Iraei, Rouhollah M. ; Bonhomme, Patrice ; Kani, Nickvash ; Manipatruni, Sasikanth ; Nikonov, Dmitri E. ; Young, Ian A. ; Naeemi, Azad
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The energy-per-bit and delay of All-Spin Logic (ASL) interconnects have been modeled. Both Al and Cu interconnect channels have been considered and the impact of size effects and dimensional scaling on their potential performance has been quantified. It is predicted that size effects will affect ASL interconnects more severely than electrical interconnects.
Keywords :
CMOS logic circuits; aluminium; copper; integrated circuit interconnections; Al; CMOS; Cu; all-spin logic interconnects; dimensional scaling; electrical interconnects; size effects; CMOS integrated circuits; Delays; Frequency modulation; Grain boundaries; Integrated circuit interconnections; Magnetic circuits; Metals;
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-5016-4
DOI :
10.1109/IITC.2014.6831833
