DocumentCode
1542045
Title
Passivation of YBCO dc-SQUIDs using polymerized hexamethyldisilasane
Author
Kramer, A. ; Mex, L. ; Francke, C. ; Muller, J. ; Kittelberger, S.
Author_Institution
Dept. of Semicond. Technol., Tech. Univ. Hamburg-Harburg, Germany
Volume
9
Issue
2
fYear
1999
fDate
6/1/1999 12:00:00 AM
Firstpage
3097
Lastpage
3100
Abstract
A passivation layer was developed to protect YBCO-devices like flux transformers and SQUIDs against deterioration due to moisture, atmospheric carbon dioxide and oxygen diffusion. The passivation layer is deposited by the polymerization of the silicon organic compound hexamethyldisilasane (HMDS-N) in a plasma enhanced chemical vapor deposition (PECVD) process. AFM investigations confirm that films of 100-150 nm thickness cover YBCO structures without any pinholes and with good step coverage. Electrical transport measurements of passivated YBCO tracks and junctions exposed to humidity and CO/sub 2/ show the excellent passivation properties of the films. No degradation in the critical parameters such as the critical current I/sub c/, the normal resistance R/sub n/ and the flux modulation depth /spl Delta/V is observed on step edge dc-SQUIDs. Investigations of the oxygen diffusion relaxation times show that they are much larger for the passivated samples than in samples without an overlay.
Keywords
SQUIDs; atomic force microscopy; barium compounds; critical current density (superconductivity); high-temperature superconductors; passivation; plasma CVD; superconducting device testing; superconducting thin films; yttrium compounds; 100 to 150 nm; AFM investigations; YBaCuO; critical current; dc-SQUIDs; diffusion relaxation times; electrical transport measurements; flux modulation depth; normal resistance; passivation; plasma enhanced chemical vapor deposition; polymerized hexamethyldisilasane; step coverage; Carbon dioxide; Moisture; Passivation; Plasma measurements; Polymers; Protection; SQUIDs; Silicon; Transformers; Yttrium barium copper oxide;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/77.783684
Filename
783684
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