Cryogenic packaging for multi-GHz electronics

Author

Tighe, T.S. ; Akerling, G. ; Smith, A.D.

Author_Institution

Space & Electron. Group, TRW Inc., Redondo Beach, CA, USA

Volume

9

Issue

2

fYear

1999

fDate

6/1/1999 12:00:00 AM

Firstpage

3173

Lastpage

3176

Abstract

To meet the packaging needs of current superconducting electronics, we have developed high speed multi-chip modules (MCMs), flexible ribbon cabling and press-contact surface mounts. We describe these new technologies and include techniques for high reliability, high-yield assembly. In addition, we present electrical and thermal characterizations of a system which incorporates these new technologies. Electrical characterization includes multi-GHz insertion loss and digital-data transmission measurements. We have performed extensive thermal modeling using SINDA software and have experimentally verified these simulations. We present the results and their general applicability to these new cryogenic packaging technologies.

Keywords

cryogenic electronics; flip-chip devices; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; losses; multichip modules; superconducting integrated circuits; surface mount technology; SINDA software; cryogenic packaging; digital-data transmission measurements; electrical characterization; flexible ribbon cabling; high speed multi-chip modules; high-yield assembly; insertion loss; multi-GHz electronics; press-contact surface mounts; reliability; superconducting electronics; thermal characterizations; thermal modeling; Assembly; Cryogenics; Electric variables measurement; Electronic packaging thermal management; Electronics packaging; Insertion loss; Loss measurement; Propagation losses; Software performance; Superconducting cables;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.783703

Filename

783703