Title :
Exploring alternative metals to Cu and W for interconnects: An ab initio insight
Author :
Sankaran, K. ; Clima, S. ; Mees, M. ; Adelmann, C. ; Tokei, Z. ; Pourtois, G.
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
The properties of alternative metals to Cu and W for interconnect applications are reviewed based on first-principles simulations and benchmarked in terms of intrinsic bulk resistivity and electromigration.
Keywords :
copper; electrical resistivity; electromigration; integrated circuit interconnections; metals; tungsten; Cu; W; electromigration; first-principles simulations; interconnect metals; intrinsic bulk resistivity; Conductivity; Crystals; Electromigration; Metals; Prototypes;
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-5016-4
DOI :
10.1109/IITC.2014.6831868
