Title :
Selective carbon nanotube growth in via structure using novel arrangement of catalytic metal
Author :
Wada, Masaki ; Ito, Ban ; Saito, Takashi ; Nishide, Daisuke ; Ishikura, Taishi ; Isobayashi, Atsunobu ; Katagiri, Masayuki ; Yamazaki, Yasuyuki ; Matsumoto, Tad ; Kitamura, Masayuki ; Li Zhang ; Watanabe, Manabu ; Sakuma, Naoshi ; Kajita, Akihiro ; Sakai,
Author_Institution :
Low-power Electron. Assoc. & Project (LEAP), Tsukuba, Japan
Abstract :
We fabricated a carbon nanotube (CNT) via structure on a 300-mm wafer. We investigated the CNT chemical-mechanical polishing (CNT-CMP) behavior in an actual via pattern structure and clarified the technical issues of the CNT-CMP process. We developed a fabrication process of CNT via structures using selective CNT growth, which has a high potential for applying CNTs to high aspect ratio via structures.
Keywords :
carbon nanotubes; chemical mechanical polishing; vias; catalytic metal; chemical mechanical polishing; selective carbon nanotube growth; size 300 nm; via structure; Abstracts; Materials; Nickel; Silicon compounds; Tin; Tungsten;
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-5016-4
DOI :
10.1109/IITC.2014.6831881
