• DocumentCode
    154301
  • Title

    Atomic layer deposition of ultrathin and continuous metal films

  • Author

    George, S.M.

  • Author_Institution
    Depts. of Chem. & Mech. Eng., Univ. of Colorado, Boulder, CO, USA
  • fYear
    2014
  • fDate
    20-23 May 2014
  • Firstpage
    325
  • Lastpage
    326
  • Abstract
    The atomic layer deposition (ALD) of ultrathin and continuous metal films is very challenging. This paper describes a general procedure that can yield an ultrathin and continuous metal ALD film using a W ALD adhesion layer.
  • Keywords
    adhesion; atomic layer deposition; metallic thin films; tungsten; ALD; W; adhesion layer; atomic layer deposition; continuous metal films; ultrathin metal films; Adhesives; Aluminum oxide; Atomic layer deposition; Films; Substrates; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4799-5016-4
  • Type

    conf

  • DOI
    10.1109/IITC.2014.6831898
  • Filename
    6831898
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=154301