DocumentCode :
154306
Title :
Photoemission study of the impact of carbon content on Mn silicate barrier formation on low-k dielectric materials
Author :
Bogan, J. ; McCoy, A.P. ; Casey, P. ; O´Connor, R. ; Byrne, Ceara ; Hughes, G.
Author_Institution :
Sch. of Phys. Sci., Dublin City Univ., Dublin, Ireland
fYear :
2014
fDate :
20-23 May 2014
Firstpage :
331
Lastpage :
334
Abstract :
In this x-ray photoelectron spectroscopy (XPS) study ultra-thin Si and MnO films were deposited on a range of low dielectric constant carbon doped oxides (CDO) with varying carbon content, in order to accurately determine the binding energy (BE) positions of the Si 2p and O 1s core level peaks as a function of carbon concentration. The results show a measurable correlation between carbon content and BE position of both the Si 2p and O 1s core level peaks. Furthermore, it has been shown that the full width at half maximum (FWHM) of the various CDO substrate peaks are significantly larger than for SiO2 making it difficult to unambiguously determine manganese silicate barrier layer formation on these substrates. In a separate set of experiments, the formation of a manganese silicate barrier layer on these CDO substrates following the deposition and high temperature annealing of thin MnO layers is inferred from analysis of the O1s and Mn2p core level spectra.
Keywords :
X-ray photoelectron spectra; annealing; binding energy; carbon; electron beam deposition; elemental semiconductors; low-k dielectric thin films; manganese compounds; permittivity; photoemission; silicon; silicon compounds; BE positions; C; CDO; FWHM; MnO; MnSiO3; Si; SiO2; X-ray photoelectron spectroscopy; binding energy; carbon concentration function; e-beam deposition; full width at half maximum; low dielectric constant carbon doped oxides; low-k dielectric materials; manganese silicate barrier layer formation; photoemission study; temperature annealing; Annealing; Carbon; Films; Manganese; Silicon; Substrates; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-5016-4
Type :
conf
DOI :
10.1109/IITC.2014.6831900
Filename :
6831900
Link To Document :
بازگشت