Title :
EMC Modeling of an Industrial Variable Speed Drive With an Adapted PEEC Method
Author :
Ardon, Vincent ; Aime, Jérémie ; Chadebec, Olivier ; Clavel, Edith ; Guichon, Jean-Michel ; Vialardi, Enrico
Author_Institution :
Grenoble Electr. Eng. Lab., Univ. de Grenoble, Grenoble, France
Abstract :
This paper presents an adapted partial element equivalent circuit (PEEC)-based methodology applied to the modeling of interconnections of power electronics devices. Although this method is already well known, the originality of this work is its use to model a device presenting an industrial complexity. To make possible this modeling, two adapted integral methods, based on two different meshings, are presented. They are dedicated respectively to the computation of parasitic inductances and capacitances and lead to an equivalent circuit of the system. From a time-domain simulation of this circuit, current and voltage sources can be extracted and used to compute the radiated near magnetic field. This approach has been applied to model a real industrial static converter via system couplings, a variable speed drive. Good agreements have been obtained between simulated and measured results on conducted and emitted electromagnetic analysis.
Keywords :
electromagnetic compatibility; power electronics; time-domain analysis; variable speed drives; EMC modeling; adapted integral methods; adapted partial element equivalent circuit based methodology; electromagnetic analysis; industrial complexity; industrial static converter; industrial variable speed drive; power electronics devices; system couplings; time-domain simulation; Circuit simulation; Computational modeling; Electromagnetic compatibility; Equivalent circuits; Integrated circuit interconnections; Magnetic field measurement; Parasitic capacitance; Power electronics; Power system modeling; Variable speed drives; Electromagnetic compatibility; fast multipole method; parasitic capacitances; parasitic elements; partial element equivalent circuit (PEEC); power electronics; power interconnections;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2010.2043420