• DocumentCode
    1544550
  • Title

    A simulation system for diffusive oxidation of silicon: a two-dimensional finite element approach

  • Author

    Rank, Ernst ; Weinert, Ulrich

  • Author_Institution
    Siemens AG, Munchen, West Germany
  • Volume
    9
  • Issue
    5
  • fYear
    1990
  • fDate
    5/1/1990 12:00:00 AM
  • Firstpage
    543
  • Lastpage
    550
  • Abstract
    A numerical approach to the simulation of two-dimensional local oxidation of silicon is presented. The key idea is the description of the oxidation as a three-component thermodynamic process involving silicon, silicon dioxide, and oxidant molecules. This results in a reactive layer of finite width, in contrast to the sharp interface between silicon and dioxide in the conventional formulation. The numerical approximation takes advantage of this description in a finite-element approach which models silicon, dioxide, and reactive layer as a whole, removing the necessity of tracking the interface with element edges. It is shown that a suitable parameter identification results in an interface motion equivalent to that of the Deal-Grove model. Numerical examples show the advantages of the approach
  • Keywords
    elemental semiconductors; finite element analysis; oxidation; parameter estimation; semiconductor-insulator boundaries; silicon; simulation; 2D local oxidation; Si-SiO2; diffusive oxidation; interface motion; oxidant molecules; parameter identification; reactive layer; simulation system; three-component thermodynamic process; two-dimensional finite element approach; Chemicals; Elasticity; Fabrication; Finite element methods; Oxidation; Parameter estimation; Partial differential equations; Silicon compounds; Stress; Viscosity;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.55174
  • Filename
    55174