• DocumentCode
    1544828
  • Title

    When every atom counts

  • Author

    Miranda, Miguel

  • Volume
    49
  • Issue
    7
  • fYear
    2012
  • fDate
    7/1/2012 12:00:00 AM
  • Firstpage
    32
  • Lastpage
    32
  • Abstract
    Today´s chips are marvels of mass production. Tens of thousands of silicon wafers can move through a single fab in a month, each one carted from tool to tool, blasted by heat, bombarded by ions, immersed in vapor, coated with chemicals, hit with radiation, and exposed to acid. It can take months and hundreds of steps to transform a plain piece of silicon into an array of chips. But at the end of this elaborate assembly line, chipmakers finally get a pile of identical devices that perform just as their designers intended.
  • Keywords
    Integrated circuit modeling; Random access memory; Semiconductor process modeling; Silicon; Transistors; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.2012.6221080
  • Filename
    6221080