DocumentCode
1544828
Title
When every atom counts
Author
Miranda, Miguel
Volume
49
Issue
7
fYear
2012
fDate
7/1/2012 12:00:00 AM
Firstpage
32
Lastpage
32
Abstract
Today´s chips are marvels of mass production. Tens of thousands of silicon wafers can move through a single fab in a month, each one carted from tool to tool, blasted by heat, bombarded by ions, immersed in vapor, coated with chemicals, hit with radiation, and exposed to acid. It can take months and hundreds of steps to transform a plain piece of silicon into an array of chips. But at the end of this elaborate assembly line, chipmakers finally get a pile of identical devices that perform just as their designers intended.
Keywords
Integrated circuit modeling; Random access memory; Semiconductor process modeling; Silicon; Transistors; Wafer scale integration;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.2012.6221080
Filename
6221080
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