DocumentCode
1545390
Title
Novel Concept of the Three-Dimensional Vertical FG nand Flash Memory Using the Separated-Sidewall Control Gate
Author
Seo, Moon-Sik ; Lee, Bong-Hoon ; Park, Sung-Kye ; Endoh, Tetsuo
Author_Institution
Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
Volume
59
Issue
8
fYear
2012
Firstpage
2078
Lastpage
2084
Abstract
Recently, we proposed a novel 3-D vertical floating gate (FG)-type nand Flash memory cell array using the separated-sidewall control gate (CG) (S-SCG). This novel cell consists of one cylindrical FG with line-type CG and S-SCG structures. For simplifying the process flow, we realized the common S-SCG lines by using the prestacked polysilicon layer, through which variable medium voltages are applied not only to control the electrically inverted S/D region but also to assist the program and erase operations. In this paper, we successfully demonstrate the normal Flash cell operation and show its superior performances in comparison with the recent 3-D FG nand cells by using the cylindrical device simulation. It is shown that the proposed cell can realize the highest CG coupling ratio, low-voltage cell operations of program with 15 V at Vth = 4V and erase with 14 V at Vth = -3V , good retention-mode electric field, and sufficient read-mode on-current margin. Moreover, the proposed S-SCG cell array can fully suppress both the interference effects and the disturbance problems at the same time by removing the direct coupling effects in the same cell string, which are the most critical problems of the recent 3-D vertical stacked cell structures. Above all, the proposed cell array has good potential for terabit 3-D vertical nand Flash cell array with highly reliable multilevel cell operation.
Keywords
NAND circuits; flash memories; 3D vertical FG NAND flash memory cell array; 3D vertical floating gate NAND flash memory cell array; 3D vertical stacked cell structure; CG coupling ratio; cell string; cylindrical device simulation; direct coupling effect; flash cell operation; prestacked polysilicon layer; reliable multilevel cell operation; retention mode electric field; separated sidewall control gate; voltage -3 V; voltage 14 V; voltage 15 V; voltage 4 V; Arrays; Capacitance; Couplings; Flash memory; Interference; Logic gates; Reliability; 3-D vertical stacked cell; Cylindrical floating gate (FG); FG; GAA; SCG; nand Flash memory; separated-sidewall control gate (CG) (SCG) (S-SCG);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2012.2200682
Filename
6221975
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