DocumentCode :
1546083
Title :
Optically interconnected electronic chips: a tutorial and review of the technology
Author :
Forbes, M. ; Gourlay, J. ; Desmulliez, M.
Author_Institution :
Analog-Mixed Signal Design Group, Tality Corp., Livingston, UK
Volume :
13
Issue :
5
fYear :
2001
fDate :
10/1/2001 12:00:00 AM
Firstpage :
221
Lastpage :
232
Abstract :
Optoelectronic interconnects between VLSI chips have been identified by the Semiconductor Industry Association (SIA) Roadmap as one of the few solutions to overcoming the communication bandwidth bottleneck between VLSI chips. Large-scale demonstrators based on optical interconnects, when fully operational, can exhibit today the same aggregate bandwidth as that foreseen by the Roadmap for the year 2007. Massive parallelism, low input/output driving energy over large distances, and synchronous processing of hundreds of optical information input channels mean that these prototypes can potentially provide on/off communication rates in the tera-pin-Hz region (i.e., a total capacity of one terabit/s). After discussing the limitations of electrical interconnects this paper reviews the means of integrating optoelectronic components with VLSI chips, suitable types of optoelectronic device and the three main approaches to constructing optical data links: fibre-ribbons, planar waveguides and free-space optics
Keywords :
VLSI; integrated optoelectronics; optical interconnections; optical links; parallel architectures; planar waveguides; Semiconductor Industry Association; VLSI chips; communication bandwidth bottleneck; electrical interconnects; fibre-ribbons; free-space optics; large-scale demonstrators; low input/output driving energy; massive parallelism; on/off communication rates; optical data links; optical information input channels; optical packaging; optically interconnected electronic chips; optoelectronic interconnects; planar waveguides; synchronous processing;
fLanguage :
English
Journal_Title :
Electronics & Communication Engineering Journal
Publisher :
iet
ISSN :
0954-0695
Type :
jour
DOI :
10.1049/ecej:20010506
Filename :
962669
Link To Document :
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