DocumentCode :
1546322
Title :
Contributions from the seventh topical meeting on electrical performance of electronic packaging
Author :
Deutsch, A. ; Swaminathan, Madhavan
Author_Institution :
IBM Corp.
Volume :
22
Issue :
3
fYear :
1999
fDate :
8/1/1999 12:00:00 AM
Firstpage :
238
Lastpage :
239
Keywords :
CMOS technology; Crosstalk; Electronics packaging; Millimeter wave measurements; Millimeter wave technology; NIST; Power distribution; Power system modeling; Power system simulation; Wiring;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.1999.784470
Filename :
784470
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1546322
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