DocumentCode
1546334
Title
Contribution of resonance to ground bounce in lossy thin film planes
Author
Pannala, Sreemala ; Bandyopadhyay, Jaya ; Swaminathan, Madhavan
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
22
Issue
3
fYear
1999
fDate
8/1/1999 12:00:00 AM
Firstpage
249
Lastpage
258
Abstract
This paper discusses the pulse propagation effects on lossy thin film planes. The ground bounce phenomena produced by the resonance on planes has been captured using a combination of modeling techniques and measurements. Macromodeling method has been used to explain the transient phenomena on planes by using the dominant poles and residues of the system
Keywords
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; losses; transients; IC packaging; dominant poles; ground bounce; lossy thin film planes; macromodeling method; modeling techniques; pulse propagation effects; residues; resonance; transient phenomena; Electronics packaging; Frequency domain analysis; Impedance; Power distribution; Power system transients; Propagation losses; Resonance; Switching circuits; Time measurement; Transistors;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.784472
Filename
784472
Link To Document