• DocumentCode
    1546351
  • Title

    Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination

  • Author

    Novak, Istvan

  • Author_Institution
    Sun Microsyst. Inc., Burlington, MA, USA
  • Volume
    22
  • Issue
    3
  • fYear
    1999
  • fDate
    8/1/1999 12:00:00 AM
  • Firstpage
    274
  • Lastpage
    283
  • Abstract
    Power and ground planes are required to have low impedance over a wide range of frequencies. Parallel ground and power planes in multilayer printed-circuit boards exhibit multiple resonances, which increase the impedance and also the radiation from the edge of the board. Resistive termination along the board edges reduces the resonance peaks. Simple and straightforward design expressions, simulated self and transfer impedances, as well as measured impedance plots are presented for power-ground planes
  • Keywords
    circuit noise; electric impedance; electromagnetic interference; interference suppression; printed circuit design; EMI; design; dissipative edge termination; ground plane; multilayer printed circuit board; multiple resonance; power plane; resistive termination; self-impedance; simultaneous switching noise; transfer impedance; Bandwidth; CMOS logic circuits; Computational modeling; Electromagnetic interference; Impedance measurement; Logic design; Noise reduction; Resonance; Silicon; Voltage;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.784475
  • Filename
    784475