Title :
Electrical performance of chip-on-chip modules
Author :
Low, Yee L. ; O´Connor, Kevin J.
Author_Institution :
Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
fDate :
8/1/1999 12:00:00 AM
Abstract :
Chip-on-chip technology is a low-cost alternate solution to embedded memory technology for achieving tight logic and memory integration. However, with the inclusion of two or more bare dies in a common package, we inevitably alter the electrical characteristics of these integrated circuit (IC) devices. To ensure each device functions as designed, we identify several key electrical issues associated with signal transmission, power distribution system, and input/output (I/O) buffers that could potentially limit the performance of chip-on-chip modules. In addition, we provide a detailed comparison between chip-on-chip and conventional printed wiring board (PWB) implementations to demonstrate the superior electrical characteristics of these chip-on-chip modules
Keywords :
integrated circuit packaging; modules; chip-on-chip module; electrical characteristics; input/output buffer; integrated circuit; interconnect; logic-memory integration; package; power distribution system; signal transmission; Application specific integrated circuits; Electric variables; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Logic circuits; Logic devices; Routing; Wiring;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.784479
