Title :
RF/microwave characterization of multilayer ceramic-based MCM technology
Author :
Sutono, Albert ; Pham, Anh-Vu H. ; Laskar, Joy ; Smith, William R.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
8/1/1999 12:00:00 AM
Abstract :
We present RF/microwave characterization of a 20-layer ceramic-based multichip module (MCM-C) on low temperature co-fired ceramic (LTCC). We investigated material properties and performance of embedded passives by design, fabrication and characterization of planar and multilayer integral inductors. Uniform dielectric constant, low loss property and high Q passives fabricated using this technology demonstrate the feasibility for implementing hybrid RF/microwave systems
Keywords :
Q-factor; ceramic packaging; dielectric losses; inductors; multichip modules; permittivity; MCM-C technology; Q-factor; dielectric constant; embedded passive; hybrid RF-microwave packaging; loss; low temperature co-fired ceramic; multichip module; multilayer ceramic; multilayer inductor; planar inductor; Ceramics; Dielectric constant; Dielectric losses; Fabrication; Inductors; Material properties; Multichip modules; Nonhomogeneous media; Radio frequency; Temperature;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.784480
