Title :
Spiral transmission-line baluns for RF multichip module packages
Author :
Yoon, Yeong J. ; Lu, Yicheng ; Frye, Robert C. ; Smith, Peter R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
fDate :
8/1/1999 12:00:00 AM
Abstract :
We describe a design method and lumped model for a circular spiral transmission-line balun. All lumped values are extracted from the geometric parameters of the balun. From simulation, the design parameters with well predicted characteristics are defined. The balun is fabricated using multi-chip module processing technology, which is suitable for integration in RF packages. Measurements show a wide bandwidth of 1.5-4.1 GHz and excellent balanced outputs. Amplitude imbalance less than 0.5 dB and phase imbalance less than 4° are achieved. The simulation results are compared with the measurement. The model captures all important properties of the balun with reasonably high accuracy
Keywords :
UHF integrated circuits; baluns; integrated circuit packaging; microwave integrated circuits; multichip modules; 1.5 to 4.1 GHz; RF multichip module packages; amplitude imbalance; balanced outputs; circular spiral transmission-line baluns; design method; design parameters; geometric parameters; lumped model; multi-chip module processing technology; phase imbalance; Coaxial components; Design methodology; Distributed parameter circuits; Impedance matching; Multichip modules; Packaging; Power transmission lines; Radio frequency; Spirals; Transmission lines;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.784481
