Title :
Electrical characterization of integrated circuit molding compound
Author :
Green, Christopher C. ; Seligman, Jeffrey M. ; Prince, John L. ; Virga, Kathleen L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fDate :
8/1/1999 12:00:00 AM
Abstract :
Broadband dielectric characterization techniques were applied to a novolac epoxy molding compound used in the integrated circuit industry. Both dielectric loss tangent and relative dielectric constant were determined over the frequency range from 100 MHz to 1.4 GHz, using two independent measurement methods. The molding compound was in “as-molded condition”, which resembles the use conditions for the material
Keywords :
dielectric loss measurement; integrated circuit packaging; moulding; permittivity measurement; 100 MHz to 1.4 GHz; as-molded condition; broadband dielectric characterization techniques; dielectric loss tangent; independent measurement methods; integrated circuit molding compound; novolac epoxy molding compound; relative dielectric constant; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Fixtures; Frequency; Impedance; Reflection; Stripline; Testing;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.784482
