DocumentCode :
1546417
Title :
International conference on multichip modules and high density packaging
Author :
Johnson, R. Wayne
Author_Institution :
Auburn University
Volume :
22
Issue :
3
fYear :
1999
fDate :
8/1/1999 12:00:00 AM
Firstpage :
365
Lastpage :
365
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.1999.784486
Filename :
784486
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1546417
