DocumentCode

1546417

Title

International conference on multichip modules and high density packaging

Author

Johnson, R. Wayne

Author_Institution

Auburn University

Volume

22

Issue

3

fYear

1999

fDate

8/1/1999 12:00:00 AM

Firstpage

365

Lastpage

365

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.1999.784486

Filename

784486