Title :
A compact MU-interface, 2.5-Gb/s optical transmitter module with LD-driver IC embedded in L-shaped wiring substrate
Author :
Ishitsuka, Fuminori ; Iwasaki, Noboru ; Hirose, Masaki ; Yanagibashi, Mitsuaki ; Ichino, Haruhiko ; Ando, Yasuhiro
Author_Institution :
NTT Telecomm. Energy Labs., Tokyo, Japan
fDate :
8/1/1999 12:00:00 AM
Abstract :
A 6.2-cc MU interface optical transmitter module has been developed in a compact packaging configuration that allows modules to be mounted side by side on a system board. The module employs an MU receptacle for optical output and miniature coaxial receptacles for electrical input. An L-shaped high-speed wiring substrate in a package cavity allows thermal isolation of a laser-diode driver IC (LD-DR) from the 1.55-μm distributed feedback laser diode (DFB-LD) mounted on a thermoelectric (TE) cooler. A confocal two-aspheric-lens circuit is used for high-performance coupling of the DFB-LD to a dispersion-shifted fiber (DSF). A module using the proposed configuration has been evaluated at temperatures from 10-65°C. Experiments with the module showed good electrical performance at a bit rate of 2.5 Gb/s, low power dissipation (less than 1.8 W; only 0.33 W for the LD-DR), and high optical coupling efficiency (over 50%)
Keywords :
distributed feedback lasers; driver circuits; integrated circuit packaging; integrated optoelectronics; modules; optical interconnections; optical transmitters; semiconductor lasers; thermal management (packaging); 1.55 micron; 2.5 Gbit/s; LD-driver IC; coaxial connector; compact MU-interface; compact packaging configuration; confocal two-aspheric-lens circuit; dispersion-shifted fiber; distributed feedback laser diode; electrical performance; embedded in L-shaped wiring substrate; high-performance coupling; low power dissipation; miniature coaxial receptacles; optical transmitter module; side mounted modules; thermal isolation; thermoelectric cooler; Coaxial components; Distributed feedback devices; Driver circuits; Fiber lasers; High speed optical techniques; Integrated circuit packaging; Laser feedback; Optical feedback; Optical transmitters; Wiring;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.784499