Stress-buffer and passivation processes for Si and GaAs IC´s and passive components using photosensitive BCB: process technology and reliability data

Author

Ganrou, P.E. ; Rogers, W. Boyd ; Scheck, Dan M. ; Strandjord, Andrew J G ; Ida, Yasu ; Ohba, Kaoru

Author_Institution

Dow Chem., Research Triangle Park, NC, USA

Volume

22

Issue

3

fYear

1999

fDate

8/1/1999 12:00:00 AM

Firstpage

487

Lastpage

498

Abstract

Polymer coatings are applied to chips and passive components to provide stress relief between the device/component and the plastic package and/or to provide mechanical and environmental protection. The semiconductor industry is actively pursuing a one mask, photosensitive dielectric process for stress-buffer and secondary passivation of memory die. A one mask photo-benzocyclobutene (BCB) process is compared to traditional two mask wet etch processes. This new one mask process reveals 1/3 the total wafer processing time and equivalent reliability (traditional MIL 883C testing) for passivated 100 lead static random access memory components (SRAMs). Reliability data are also presented for GaAs chips, and NiCr and TaN resistors which have been passivated by BCB

Keywords

SRAM chips; integrated circuit packaging; integrated circuit reliability; masks; passivation; plastic packaging; GaAs; Si; equivalent reliability; memory die; one mask process; passivation processes; passive components; photo-benzocyclobutene; photosensitive BCB; plastic package; polymer coatings; process technology; reliability data; static random access memory components; stress-buffer processes; wafer processing time; Dielectrics; Electronics industry; Gallium arsenide; Passivation; Plastic packaging; Polymer films; Protection; Semiconductor device packaging; Stress; Wet etching;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.784503

Filename

784503