DocumentCode
1547015
Title
CO/sub 2/ makes fillings for chip cavities
Author
Moore, S.K.
Volume
38
Issue
11
fYear
2001
Firstpage
28
Lastpage
29
Keywords
Carbon dioxide; Chemical technology; Computational fluid dynamics; Copper; Filling; Global warming; Green cleaning; Hydrogen; Semiconductor device manufacture; Solvents;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.2001.963245
Filename
963245
Link To Document