DocumentCode :
1547015
Title :
CO/sub 2/ makes fillings for chip cavities
Author :
Moore, S.K.
Volume :
38
Issue :
11
fYear :
2001
Firstpage :
28
Lastpage :
29
Keywords :
Carbon dioxide; Chemical technology; Computational fluid dynamics; Copper; Filling; Global warming; Green cleaning; Hydrogen; Semiconductor device manufacture; Solvents;
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.2001.963245
Filename :
963245
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1547015
