• DocumentCode
    1547384
  • Title

    Contribution of grain boundary planes to superconducting coupling in YBCO

  • Author

    Mironova, M. ; Stolbov, S. ; Guoping Du ; Salama, K.

  • Author_Institution
    Texas Center for Supercond., Houston Univ., TX, USA
  • Volume
    9
  • Issue
    2
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    1626
  • Lastpage
    1629
  • Abstract
    High-angle grain boundaries are considered to be the main obstacle for current flow in polycrystalline bulk superconductors. In bicrystal YBCO thin films, it has been shown that the current carrying behavior of grain boundaries is strongly dependent on misorientation angles. However, grain boundaries formed by the liquid phase removal method in bulk YBCO do not show such dependence, where high-angle grain boundaries are found to be capable of carrying high currents. To understand the mechanism by which current is carried by these high-angle grain boundaries, we performed TEM studies on two high-angle boundaries whose J/sub c/ varied considerably. The misorientation characteristics and grain boundary planes for these grain boundaries were determined.
  • Keywords
    barium compounds; bicrystals; critical current density (superconductivity); grain boundaries; high-temperature superconductors; superconducting thin films; transmission electron microscopy; yttrium compounds; TEM; YBaCuO; bicrystal thin films; critical current density; current flow; grain boundary planes contribution; high temperature superconductors; high-angle grain boundaries; liquid phase removal method; misorientation angles; misorientation characteristics; polycrystalline bulk superconductors; superconducting coupling; transmission electron microscopy; Grain boundaries; High temperature superconductors; Optical microscopy; Superconducting films; Superconducting materials; Superconducting thin films; Superconductivity; Transistors; Transmission electron microscopy; Yttrium barium copper oxide;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.784709
  • Filename
    784709