• DocumentCode
    1547753
  • Title

    A quantitative analysis of time-decay reproducible stress-induced leakage current in SiO2 films

  • Author

    Sakakibara, Kiyohiko ; Ajika, Natsuo ; Eikyu, Katsumi ; Ishikawa, Kiyoshi ; Miyoshi, Hirokazu

  • Author_Institution
    ULSI Lab., Mitsubishi Electr. Corp., Hyogo, Japan
  • Volume
    44
  • Issue
    6
  • fYear
    1997
  • fDate
    6/1/1997 12:00:00 AM
  • Firstpage
    1002
  • Lastpage
    1008
  • Abstract
    In the cases of both Fowler-Nordheim (FN) stress and substrate hot-hole stress, three reproducible stress-induced leakage current (SILC) components have been found for the repeated unipolar gate-voltage scans in 9.2 nm wet oxides. To clarify the mechanisms of these current components, a quantitative analysis has been developed. By precisely modeling the phonon assisted tunneling process, it has been shown that the E-J and t-J characteristics of the reproducible current components can be completely simulated as electron tunneling processes into the neutral traps, each with a single trap level. From this analysis, the physical parameters of the traps have been estimated with a reasonable degree of accuracy. Furthermore, the increase in distribution of the neutral trap density toward both the SiO2 interfaces has also been estimated
  • Keywords
    MOSFET; dielectric thin films; electric breakdown; electron traps; hot carriers; interface states; leakage currents; semiconductor device models; semiconductor-insulator boundaries; silicon compounds; tunnelling; 9.2 nm; Fowler-Nordheim stress; SiO2 films; SiO2-Si; current components; electron tunneling processes; modeling; neutral trap density; phonon assisted tunneling process; quantitative analysis; stress-induced leakage current; substrate hot-hole stress; time-decay reproducible SILC; unipolar gate-voltage scans; Current measurement; Degradation; Electric variables; Electron traps; Leakage current; MOSFETs; Phonons; Stress measurement; Tunneling; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.585557
  • Filename
    585557