Title :
Microwave surface resistance of YBCO bulk samples prepared by addition of HgO to YBCO system
Author :
Misra, M. ; Pandey, A. ; Kataria, N.D. ; Sharma, R.G. ; Srivastava, G.P.
Author_Institution :
Supercond. Div., Nat. Phys. Lab., New Delhi, India
fDate :
6/1/1999 12:00:00 AM
Abstract :
The paper reports microwave surface resistance (R/sub s/) measurement on yttrium barium copper oxide (YBCO) bulk samples, prepared by an alternate route, namely by addition of mercury oxide (HgO) to YBCO system. R/sub s/ is measured using a TE/sub 011/ mode cylindrical cavity, at 20 GHz, by the end plate substitution technique. HgO added to the YBCO system has the advantage that oxygen in HgO acts as a copious source of oxygen and therefore does not require sintering in oxygen flow. Powder X-ray diffraction studies confirm the formation of pure orthorhombic 123 phase without any indication of Hg or known Hg compounds. The specimen with 0.5 wt.% of HgO added to the YBCO system showed superior superconducting properties including microwave surface resistance (22.5 m/spl Omega/ at 77 K and 20.0014 GHz). The R/sub s/ has also been measured as a function of the area of the sample that yields consistent value confirming surface homogeneity. This is believed due to stoichiometric oxygenation and large number of well connected grains.
Keywords :
X-ray diffraction; barium compounds; high-frequency effects; high-temperature superconductors; mercury compounds; sintering; surface conductivity; yttrium compounds; 20 GHz; 77 K; HgO addition; TE/sub 011/ mode cylindrical cavity; YBa/sub 2/Cu/sub 3/O/sub 7/:HgO; bulk samples; end plate substitution; microwave surface resistance; powder X-ray diffraction; pure orthorhombic 123 phase; sintering; surface homogeneity; well connected grains; Area measurement; Electrical resistance measurement; Mercury (metals); Microwave measurements; Powders; Superconducting microwave devices; Surface resistance; Tellurium; X-ray diffraction; Yttrium barium copper oxide;
Journal_Title :
Applied Superconductivity, IEEE Transactions on