Micromachined flat-walled valveless diffuser pumps

Author

Olsson, Anders ; Enoksson, Peter ; Stemme, Göran ; Stemme, Erik

Author_Institution

Dept. of Signals, Sensors & Syst., R. Inst. of Technol., Stockholm, Sweden

Volume

6

Issue

2

fYear

1997

fDate

6/1/1997 12:00:00 AM

Firstpage

161

Lastpage

166

Abstract

The first valveless diffuser pump fabricated using the latest technology in deep reactive ion etching (DRIE) is presented. The pump was fabricated in a two-mask micromachining process in a silicon wafer polished on both sides, anodically bonded to a glass wafer. Pump chambers and diffuser elements were etched in the silicon wafer using DRIE, while inlet and outlet holes are etched using an anisotropic etch. The DRIE etch resulted in rectangular diffuser cross sections. Results are presented on pumps with different diffuser dimensions in terms of diffuser neck width, length, and angle. The maximum pump pressure is 7.6 m H₂O (74 kPa), and the maximum pump flow is 2.3 ml/min for water

Keywords

diffusion pumps; micromachining; micropumps; sputter etching; 74 kPa; Si; anisotropic etching; deep reactive ion etching; fabrication; flat-walled valveless diffuser pump; silicon wafer; two-mask micromachining; Anisotropic magnetoresistance; Glass; Micromachining; Micropumps; Neck; Pumps; Silicon; Valves; Wafer bonding; Wet etching;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/84.585794

Filename

585794