DocumentCode :
1548268
Title :
Dissolution and resolidification of SmBa/sub 2/Cu/sub 3/O/sub 7-y/ seed during top seeded melt texturing of YBa/sub 2/Cu/sub 3/O/sub 7-y/
Author :
Jee, Y.A. ; Gye-Won Hong ; Chan-Joong Kim ; Tae-Hyun Sung
Author_Institution :
Supercond. Res. Lab., Korea Atomic Energy Res. Inst., Taejon, South Korea
Volume :
9
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
2097
Lastpage :
2100
Abstract :
During top-seeded melt growth of a YBa/sub 2/Cu/sub 3/O/sub 7-y/ (Y123) single-domain crystal, seed dissolution occurred while the seed was in contact with Ba-Cu-O liquid, and then the dissolved parts were resolidified during cooling. The growth mode of the Y123 crystal was directly affected by the resolidification process of the dissolved part. When the melted part of the seed was resolidified to a polycrystal, Y123 grew also as a polycrystalline form. In contrast, when the dissolved part of the seed completely recovered its mother orientation during cooling, a single-domain Y123 crystal could be obtained. The dissolution behavior of the SmBa/sub 2/Cu/sub 3/O/sub 7-y/ (Sm123) seed is explained in terms of the solubility of samarium in Ba-Cu-O liquid. The resolidification mode of the melted part is discussed in terms of the Sm content within the interdiffusion layer of Sm and Y.
Keywords :
barium compounds; chemical interdiffusion; crystal growth from melt; dissolving; high-temperature superconductors; melt texturing; solidification; yttrium compounds; Sm content; Sm123 seed; SmBa/sub 2/Cu/sub 3/O/sub 7/; YBa/sub 2/Cu/sub 3/O/sub 7/; dissolution; growth mode; interdiffusion layer; polycrystalline form; resolidification; single-domain crystal; solubility; top seeded melt texturing; Crystallography; Crystals; Heating; Performance analysis; Performance evaluation; Shape; Smoothing methods; Temperature; Testing; X-ray scattering;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.784880
Filename :
784880
Link To Document :
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