DocumentCode :
154840
Title :
A HIL Simulation Platform for Locomotive Adhesion Control
Author :
Siyu Zhang ; Jingchun Huang ; Jian Xiao ; Kai Chen
Author_Institution :
Electr. Eng. Dept., Southwest Jiaotong Univ., Chengdu, China
fYear :
2014
fDate :
8-11 Oct. 2014
Firstpage :
2259
Lastpage :
2260
Abstract :
This paper proposed a novel HIL simulation platform which can supply a reliable locomotive model for adhesion control. Motor torque and currents can be shown in the model of traction motor. And writing the adhesion control algorithm to DSP makes it easier to test the algorithm in real locomotive.
Keywords :
adhesion; control engineering computing; digital signal processing chips; digital simulation; locomotives; torque control; DSP; HIL simulation platform; locomotive adhesion control; motor currents; motor torque; reliable locomotive model; traction motor; Conferences; Intelligent transportation systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Transportation Systems (ITSC), 2014 IEEE 17th International Conference on
Conference_Location :
Qingdao
Type :
conf
DOI :
10.1109/ITSC.2014.6958045
Filename :
6958045
Link To Document :
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