Title :
High-temperature superconducting beam forming network for communication system applications
Author :
Kobeissi, H. ; Drolet, D.J. ; Ke Wu ; Stubbs, M.G. ; Larralde, G. ; Rao, S.K.
Author_Institution :
Ecole Polytech., Montreal, Que., Canada
fDate :
3/1/1997 12:00:00 AM
Abstract :
This paper presents an application of the high-temperature superconductor (HTS) technology to the development of a high-performance antenna beam forming network (BFN) for communication systems. Design and measurements are made in Ku-band with a multiple power divider technique involving a cascade of 3-dB branch-line couplers. Three microstrip couplers are integrated to form a one-to-four BFN. An experimental prototype is fabricated with TlBaCaCuO thin film deposited onto LaAlO/sub 3/ substrate. Power handling capability of related HTS components such as line, bend, and BFN are also studied together with third-order intermodulation characteristics. It is shown that theoretical prediction is consistent with experimental results, presenting insertion loss of the four output ports ranging from 6.1-6.4 dB and return loss better than 14 dB at 11.95 GHz. These preliminary results demonstrate the potential of extending such a power divider technique in designing an N-port BFN. It is also indicated that the proposed HTS BFN scheme can offer advantages compared to its conventional counterpart, namely, a significant reduction in size/weight and low power loss.
Keywords :
antenna accessories; high-temperature superconductors; intermodulation; microwave antennas; power dividers; superconducting microwave devices; 11.95 dB; 14 dB; 6.1 to 6.4 dB; Ku-band; LaAlO/sub 3/; LaAlO/sub 3/ substrate; N-port BFN; TlBaCaCuO; TlBaCaCuO thin film; antenna beam forming network; bend; branch-line coupler cascade; communication system; high-temperature superconducting technology; insertion loss; intermodulation; line; microstrip coupler; multiple power divider; power handling; return loss; Antenna measurements; Communication systems; Couplers; High temperature superconductors; Microstrip; Power dividers; Power measurement; Prototypes; Sputtering; Substrates;
Journal_Title :
Applied Superconductivity, IEEE Transactions on