DocumentCode :
1548817
Title :
Phase stability and grain growth in an Ag/Bi-2223 composite conductor prepared using fine-grained Bi-2223 as a precursor
Author :
Merchant, N.N. ; Miller, D.J. ; Maroni, V.A. ; Parrella, R.D. ; Li, Q. ; Rupich, M.W. ; Carter, W.L. ; Riley, G.N., Jr.
Author_Institution :
Argonne Nat. Lab., IL, USA
Volume :
9
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
2545
Lastpage :
2548
Abstract :
We have investigated the stability and microstructural transformability of the Bi-2223 phase in a silver-sheathed monofilament composite tape fabricated using fine grained Bi/sub 1.7/Pb/sub 0.3/Sr/sub 1.9/Ca/sub 2.0/Cu/sub 3.0/O/sub y/ (Bi-2223) as the precursor powder. The fully formed Bi-2223 precursor was prepared using established procedures. The purpose of this study was to explore the prospects for growing textured, large-grain-size Bi-2223 from the fine-grained precursor by process parameter perturbations. These perturbations included thermal ramp up variations, programmed heat treatment temperature and oxygen pressure fluctuations, and parameter manipulations during cool-down. Our results show that the types of heat treatments used in conventional oxide-powder-in-tube (OPIT) processing do not facilitate Bi-2223 grain growth when the precursor powder is preconverted Bi-2223. We also observed that the Bi-2223 partially decomposed during conventional thermal ramp-up in 0.075 atm O/sub 2/, but that this decomposition can be inhibited by ramping up in a reduced oxygen pressure. A pathway was found for back-reacting the fine-grained Bi-2223 (to Bi-2212, Bi-2201 and nonsuperconducting secondary phases), then reforming large-grained Bi-2223 in a colony microstructure having some distinct differences from that produced during conventional OPIT processing.
Keywords :
annealing; bismuth compounds; calcium compounds; ceramics; composite superconductors; cracks; decomposition; grain growth; grain size; heat treatment; high-temperature superconductors; lead compounds; phase equilibrium; powder technology; quenching (thermal); scanning electron microscopy; silver; stoichiometry; strontium compounds; superconducting tapes; texture; transmission electron microscopy; 0 to 20 min; 0.02 atm; 0.075 atm; 825 C; 855 C; Ag-Bi/sub 1.7/Pb/sub 0.3/Sr/sub 1.9/Ca/sub 2.0/Cu/sub 3.0/O; Ag/Bi-2223 composite conductor; O/sub 2/ pressure fluctuations; colony microstructure; fine-grained Bi-2223 precursor; grain growth; microstructural transformability; phase stability; programmed heat treatment temperature; stability; Assembly; Bismuth; Conducting materials; Conductors; Heat treatment; Laboratories; Microstructure; Powders; Stability; Temperature;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.785005
Filename :
785005
Link To Document :
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